TECHNICAL SPECIFICATIONS
MAASTEK Technologies delivers precision-engineered solutions with rigorous adherence to technical standards. Our capabilities span from high-frequency RF components to advanced materials processing.
PCB FABRICATION
High-precision fabrication up to 300×300mm. We utilize FR4, PTFE, and Rogers substrates with controlled thicknesses and high-density interconnects.
POWER ELECTRONICS
SMPS and LED driver development with thermal and transient analysis. Our team specializes in high-efficiency magnetics and component stress testing.
RF & MICROWAVE
Passive and active component prototyping with S-parameter analysis up to 14GHz. We provide high-accuracy impedance matching and VNA-based testing.
MPCVD & DIAMOND
Expertise in microwave plasma reactors and lab-grown diamond nucleation. We provide process troubleshooting and R&D support for advanced materials.
PRODUCTION CAPABILITIES
MAASTEK Technologies delivers precision-engineered fabrication and assembly solutions for high-performance electronics and advanced materials.
PCB FABRICATION
High-precision milling and etching capabilities for single and double-sided prototypes up to 300mm in size. Expertise in FR4, PTFE, and Rogers substrates.
PCBA ASSEMBLY
High-density assembly and testing services. We provide comprehensive DFM reviews and technical assessments for complex embedded and IoT hardware.
RF & MICROWAVE
Specialized fabrication for high-frequency components, filters, and microwave modules. Capable of impedance matching and S-parameter prototyping up to 14GHz.
LEAD TIMES
Typical turnaround is 2–7 working days after technical approval. Our modular infrastructure ensures rapid prototyping and documented B2B delivery.